XR125
| Grade | Co Wt% |
粒度 WC Grain Size μm |
密度 Density g/cm3 |
硬度 Hardness HRA |
断裂韧性 MPa•m1/2 |
抗弯强度 MPa |
| 12 | 1-2 | 14.20 | 90.0 | 14.3 | 3800 |
Material specification
Medium - fine grain structure, 12% corrosion - resistant bonding
phase, good toughness
It is suitable for high speed stamping of stainless steel belt, copper
belt and other materials below 1mm.
Application
Connector, IC lead frame, IC packaging mold, etc., processing thin
pure copper, pure iron, aluminum, etc. Used for mould of electrical
components and processing thick copper
"SEM photo SEM Photo1000X"
